Futurewei has opening for Material Research intern. Candidate would be tasked with studying and investigate materials’ structure and property. Specific duties include development of polymer-based or particle-based composite materials through modeling and lab experiments. The intern will have the opportunity to work alongside and learn from senior researchers to explore and develop new and impactful technologies.

Responsibilities

·       Obtain information that can be used to develop new multifunctional materials.

·       Prepare reports, manuscripts, proposals, and technical manuals for use by other scientists.

·       Perform experiments and computer modelling to study the nature, structure, and physical and chemical properties of multifunctional materials.

·       Plan laboratory experiments to confirm feasibility of processes and techniques used in the development of materials.

Qualifications

•         Master’s degree, Ph.D. or Ph.D. candidate in Material Science, Polymer Science, and relative major (Chemistry, Chemical Engineering) is preferred.

•         Knowledge and experience in inorganic materials (metal oxide, binary compound, etc.) is preferred.

•         Knowledge and hands-on experience in chemical lab. (material preparation and characterization)

•         Knowledge and experience in (or interest to learn) modeling software for material design.

•         Knowledge and experience in data science is preferred but not required.

•         Self-motivated detail-oriented team player.

•         Good verbal and written communication skills. Have track record of publishing scientific papers.

Hourly intern pay range: $18 to $59, depending on degree-seeking academic program (PhD, Master’s, Bachelor’s, etc.), years of relevant experience, year in school, internship location, credentials, qualifications, geographic location and other job-related factors. Housing allowance and relocation benefit might be provided to intern candidates who meet the qualifications.   Additional details on the compensation package will be provided to candidates during the interview process.