Position Description

System Engineer (Hybrid Bonding) @ West
Job Code 16889
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • European MNC Semiconductor Equipment Manufacturer
  • Work location: West

 

Your role:

  • Participation in the development of new or the extension of existing hardware and software modules according to current or future customer requirements (analysis, modelling, calculation, measurement, qualification)
  • Definition of requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
  • Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
  • Support product management on customer projects (occasional business travel)
  • Support manufacturing engineering on assembly and supplier issues (occasional business travel)

 

Your profile:

  • Minimum Bachelor’s degree in mechatronics, control engineering, electrical engineering or similar
  • At least 3 years work experience with Hybrid Bonding equipment or Hybrid Bonding process
  • Flair for practical work in the lab and with measurement equipment
  • Capacity for teamwork as well as initiative and personal responsibility
  • Innovative, systematic, and solution-oriented work approach
  • Flexible and able to work under pressure
  • Ability to present complex topics in appropriate ways for specific audiences

 

 

To apply, please visit to www.gmprecruit.com and search for Job Reference: 16889

To find out more about this opportunity, please contact Alexandra at: alexandra@gmprecruit.com

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Alexandra Calingo | Registration No: R1101491

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