Process Development and Support
- Collects Process Data related to Hybrid Bonding
- Defines DOE and experimental process trials
- Documents and prepares reports
- Understands the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
- Understands the process from Physics/Chemistry point of view
- Acquires knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
- Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions to problems.
- Aware and understands different customer needs and priorities
Machine & Applications Support
- Machine installation and calibration
- Machine Application Setup
- Defines Tooling and Collaterals together with Engineer team
- Prepares and executes customer demos and sample builds
Point-of Contact Support
- Data and information exchange with different stakeholders
- Roll out of new software, features set and modules
Requirements:
- Master or PhD in Physics, Semiconductor or Electronics
- Minimum 5 years of experience in a complex Technical environment, 3 years in R&D environment
- Experience within semiconductor front and backend process
- Experience in production environment an added advantage
- Excellent Metrology knowledge, as well as Material & Semiconductor Physics topics
- Matlab, JMP and statistical skills desirable
- Programming language skills desirable
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671
