Position Description

Process Development & Application Support Engineer (Hybrid Bonding)
Job Code 16914
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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Process Development and Support​​​​​​​

  • Collects Process Data related to Hybrid Bonding
  • Defines DOE and experimental process trials
  • Documents and prepares reports
  • Understands the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
  • Understands the process from Physics/Chemistry point of view
  • Acquires knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
  • Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions to problems.
  • Aware and understands different customer needs and priorities

Machine & Applications Support​​​​​​​

  • Machine installation and calibration
  • Machine Application Setup
  • Defines Tooling and Collaterals together with Engineer team
  • Prepares and executes customer demos and sample builds

Point-of Contact Support

  • Data and information exchange with different stakeholders
  • Roll out of new software, features set and modules



  • Master or PhD in Physics, Semiconductor or Electronics
  • Minimum 5 years of experience in a complex Technical environment, 3 years in R&D environment
  • Experience within semiconductor front and backend process
  • Experience in production environment an added advantage
  • Excellent Metrology knowledge, as well as Material & Semiconductor Physics topics
  • Matlab, JMP and statistical skills desirable
  • Programming language skills desirable


We regret that only shortlisted candidates will be notified.


GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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