Understands the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
Understands the process from Physics/Chemistry point of view
Acquires knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions to problems.
Aware and understands different customer needs and priorities
Machine & Applications Support
Machine installation and calibration
Machine Application Setup
Defines Tooling and Collaterals together with Engineer team
Prepares and executes customer demos and sample builds
Point-of Contact Support
Data and information exchange with different stakeholders
Roll out of new software, features set and modules
Requirements:
Master or PhD in Physics, Semiconductor or Electronics
Minimum 5 years of experience in a complex Technical environment, 3 years in R&D environment
Experience within semiconductor front and backend process
Experience in production environment an added advantage
Excellent Metrology knowledge, as well as Material & Semiconductor Physics topics
Matlab, JMP and statistical skills desirable
Programming language skills desirable
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671
