Position Description

Process Engineer (Semiconductor)
Job Code 16932
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Process Development and Support
  • Collects Process Data related to Hybrid Bonding
  • Defines DOE’s and experimental process trials  Documents and prepares reports
  • Understands the different scenarios for Hybrid bonding (die to wafer, collective die to wafer, wafer to wafer)
  • Understands the process from Physics/Chemistry point of view
  • Acquires knowledge on pre and post die bonding processes, in particular cleaning, plasma activation and annealing.
  • Provides suggestions based on analysis of results, knowledge collection from papers/journals/books/publications and customer discussions to improve the process or provide solutions to problems.



  • Master or PhD in Physics, Semiconductor or Electronics
  • Minimum 5 years of experience in a complex Technical environment, 3 years in R&D environment Experience within semiconductor front and backend process
  • R&D & Experience in global organization preferable 
  • Experience in production environment considered an asset.


To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.


We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693


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