Position Description

Die Bond System & Process Engineer (Technology Development & Experiments)
Job Code 17420
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
  • Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
  • Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
  • Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
  • Development of "Die Bonding" process technologies in anticipation of current and future demands

 

Requirements:

  • Minimum Degree qualified in Mechanical, Electrical or Mechatronic Engineeering Disciplines
  • 5 years of relevant system & process development experience in Semiconductor equipment field, particularly in Backend bonding technologies such as Die-Bonding, Wire-Bonding families
  • Possess practical lab work experience and hands-on experience with measurement equipment (Metrology, Inspection, AOI, etc)

 

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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