• Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
• Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
• Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
• Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
• Development of "Die Bonding" process technologies in anticipation of current and future demands

Requirements:

• Minimum Degree qualified in Mechanical, Electrical or Mechatronic Engineeering Disciplines
• 5 years of relevant system & process development experience in Semiconductor equipment field, particularly in Backend bonding technologies such as Die-Bonding, Wire-Bonding families
• Possess practical lab work experience and hands-on experience with measurement equipment (Metrology, Inspection, AOI, etc)

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671