Responsiblities

• Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
• Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
• Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
• Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
• Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)

Requirements

• Minimal 5 years experience
• Technical education (bachelor or master degree) from University. Ideally microsystem technology, mechanical, electrical or mechatronic.
• Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous

To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693