Position Description

System Architecture (Semiconductor equipment)
Job Code 17421
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification)
  • Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control)
  • Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
  • Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
  • Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement)



  • Minimal 5 years experience
  • Technical education (bachelor or master degree) from University. Ideally microsystem technology, mechanical, electrical or mechatronic.
  • Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous


To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.



We regret that only shortlisted candidates will be notified.


GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693

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