Configure and perform detailed product demonstration/onsite evaluation on Die bonder as assigned
Answer detailed technical questions from sales, CPM, Service personnel and Customers
Maintain an advanced technical understanding of company die bonder product and application
Collaborate with D&E and R&D in writing requirements for new features, modifications, etc
Participation in the development of new or the extension of existing hardware and software modules according to current or future customer requirements
Carry out internal acceptance test of new features and CIP developed by R&D
Ensure all technical requirements appropriately addressed with close followup with CPM and CSM relating to customer issue
Conduct DB product / application training to internal people as well as to customers as needed
Coordinate DB software issues; quaify & address it in the main releases
Able to travel on a moderate & frequent basis to customer site
Job Requirements
Working experience in Die bonding technical service / sales support function
Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
Able to read and interpret technical and engineering documents
Technical report writing skills
Demonstrated problem solving and analytical skills
Experience in product management is an added advantage
Knowledge of semiconductor industry
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lim Zi Cheng | Registration No: R2089949