Position Description

Product Specialist, Die Bonding (Semiconductor Equipment Maker)
Job Code 17795
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Configure and perform detailed product demonstration / onsite evaluation on Die bonder as assigned
  • Answer detailed technical questions from sales, CPM, Service personnel and Customers
  • Maintain an advanced technical understanding of all ESEC die bonder product and application
  • Coordinate all activities related to technical issues for potential and existing customer
  • Collaborate with D&E and R&D in writing requirements for new features, modifications, etc
  • Participation in the development of new or the extension of existing hardware and software modules according to current or future customer requirements (analysis, modelling, calculation, measurement, qualification)
  • Carry out internal acceptance test of new features and CIP developed by R&D
  • Ensure all technical requirements appropriately addressed with close followup with CPM and CSM relating to customer issue



  • Masters / Engineering Degree in Mechatronics or Electronics Engineering.
  • 3 to 5 years of working experience in Die bonding technical service / sales support
  • Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
  • Hands on experience with automatic, high speed complex equipment


To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.


We regret that only shortlisted candidates will be notified.


GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693


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