Responsibilities

• Configure and perform detailed product demonstration / onsite evaluation on Die bonder as assigned
• Answer detailed technical questions from sales, CPM, Service personnel and Customers
• Maintain an advanced technical understanding of all ESEC die bonder product and application
• Coordinate all activities related to technical issues for potential and existing customer
• Collaborate with D&E and R&D in writing requirements for new features, modifications, etc
• Participation in the development of new or the extension of existing hardware and software modules according to current or future customer requirements (analysis, modelling, calculation, measurement, qualification)
• Carry out internal acceptance test of new features and CIP developed by R&D
• Ensure all technical requirements appropriately addressed with close followup with CPM and CSM relating to customer issue

Requirements

• Masters / Engineering Degree in Mechatronics or Electronics Engineering.
• 3 to 5 years of working experience in Die bonding technical service / sales support
• Knowledge of Mechanical, Electrical, Electronics, Mechatronics systems
• Hands on experience with automatic, high speed complex equipment

To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693