The project manager is coordinating mainly hardware and software related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement.
In his function he/she is managing projects and sub projects according to the Die Attach Product Innovation Process (DAPI) by considering of proven methods, risk management and standards (Semi S2, Semi S8, CE).
He/she is responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition he/she performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project.
He/she is coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia.
In his/her role as sub project manager he/she is the interface for project coordination between the different Rnd locations and also responsible for the series introduction of projects started from other Rnd sites.
Bachelor degree from Mechatronic, Electrical or Automation.
Minimum 2 years work experience, prefer in semiconductor back end with experience in project management.
Very good command of English
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lim Zi Cheng | Registration No: R2089949