• European MNC Semiconductor Equipment Manufacturer
• Work location: West

Your role:

• The project manager is coordinating mainly hardware and software related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement.
• In his function he/she is managing projects and sub projects according to the Die Attach Product Innovation Process (DAPI) by considering of proven methods, risk management and standards
• He/she is responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition, he/she performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project.
• He/she is coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia.
• In his/her role as sub project manager he/she is the interface for project coordination between the different overseas R&D locations and also responsible for the series introduction of projects started from other R&D sites

Your profile:

• Minimum Bachelor degree from Mechatronic, Electrical or Automation
• At least 2 years’ work experience, prefer in semiconductor back end with experience in project management.
• Innovative
• Self-employed and assertive
• Flexible
• Systematic and focused
• Good presentation and communication skills
• Motivator and team player
• Excellent problem solving and analytical skills

To apply, please visit to www.gmprecruit.com and search for Job Reference: 17948

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Alexandra Calingo | Registration No: R1101491

To find out more about this opportunity, please contact Alexandra at: alexandra@gmprecruit.com