Position Description

Development EngineerĀ (Semiconductor Package Solutions)
Job Code 18033
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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Job Functions:

  • New Product Introduction and production sustaining in the area of the back end assembly. 
  • In direct collaboration with business units , RnD and assembly manufacturing sites to: 
    • Develop assembly solutions and ensure the product qualification. 
    • Meet the target with the highest level of quality and cost using optimized technology processes. 
    • Propose and implement innovative steps to enhance the manufacturability and yields. 
    • Provide technical support in rapid closure of quality issues with identified root cause and corrective actions to prevent recurrences. 


  • Degree in Mechanical Engineering or Material Science 
  • 5 years of more of relevant technology solutions development experience 
  • Knowledge of mechanical assembly processes and industrial engineering in the semiconductor ecosystem is preferred 
  • Strong team work abilities in a multicultural environment (South east Asia, China, Europe and North America) 
  • Mastery in DOE and 6 sigma approach allowing to put into application general knowledge in physic, electronic, engineering and statistical tool 
  • Service-minded and a high level of autonomy and leadership


We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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