Responsibilities:

• Yield Reporting    
  • Provide daily, weekly, monthly yield reports with detailed yield loss paretos
• Daily Yield and Product capability monitoring    
  • Daily yield loss and product capability analysis.
  • In the event of degradation from baseline capability, failure modes/patterns must be indentified immediately.
  • Associated process stages/tools must be triggered for enhance monitoring, intervention or shut down. 
• In-Line excursion and monitoring
  • Provide 1st level analysis on yield loss and excursion; provide timely and accurate feedback to process and equipment team to minimize exposure. Support yield activities and projects
• Product SPC
  • Monitor, respond and execute OOC lots disposition based on OCAP and support NQE management system.

Requirements:

• Diploma in Electrical/ Mechanical/ Materials/ Mechatronic Engineering.  
• Minimum 2 years relevant experience in wafer fabrication / packaging industries
• Good knowledge in MS office, JMP application knowledge is added advantage
• Statistical Yield Analysis skills and techniques
• Exposure to SEM/ FIB FA tools is an added advantage
• Communication skills and Team player
• Able to perform 12 hour rotating shift.

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Lim Zi Cheng  |   Registration No:  R2089949