Provide daily, weekly, monthly yield reports with detailed yield loss paretos
Daily yield loss and product capability analysis.
Identify Failure modes or patterns.
In-Line excursion and monitoring
Provide 1st level analysis on yield loss and excursion; provide timely and accurate feedback to process and equipment team to minimize exposure.
Support yield activities and projects
Monitor, respond and execute OOC lots disposition based on OCAP and support NQE management system.
Diploma in Electrical/ Mechanical/ Mechatronics Engineering or other relevant engineering disciplines
2-year's experience in wafer fabrication or packaging industries
Good knowledge in MS Office
JMP knowledge will be an added advantage
Application of SPC related skills and techniques
Able to perform 12hours rotating shift
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lim Zi Cheng | Registration No: R2089949