Job Responsibilities

Provide daily, weekly, monthly yield reports with detailed yield loss paretos

Daily yield loss and product capability analysis.

Identify Failure modes or patterns.

In-Line excursion and monitoring

Provide 1st level analysis on yield loss and excursion; provide timely and accurate feedback to process and equipment team to minimize exposure.

Support yield activities and projects

Monitor, respond and execute OOC lots disposition based on OCAP and support NQE management system.

Job Requirements
Diploma in Electrical/ Mechanical/ Mechatronics Engineering or other relevant engineering disciplines

2-year's experience in wafer fabrication or packaging industries 

Good knowledge in MS Office

JMP knowledge will be an added advantage

Application of SPC related skills and techniques

Able to perform 12hours rotating shift 

We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Lim Zi Cheng  |   Registration No:  R2089949