Position Description

Senior/Junior Equipment Technician (Semicon Front-End/ CMP, DSP, WET, Bonder, SWC, Scrubber)
Job Code 18522
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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Job Responsibilities

  • Perform scheduled equipment maintenance accordance to standard operating procedure
  • Equipment repair and troubleshooting accordance to the standard operating procedure or under the guidance from engineers
  • Troubleshoot and repair minor equipment problems and assist in major repair and troubleshooting
  • Propose improvements to SOP and explain the SOP to ensure Technicians and below adhere to SOP
  • Maintain records of all shift related events and activities
  • Propose improvement to standard operating procedure
  • In order to minimize equipment downtime, improve equipment quality, reduce maintenance cost, conform to requirements and compliance to policies and internal guidelines.
  • participate in cost reduction, improvement activities and achieve cost efficiency and effectiveness.  

Job Requirements

  • Diploma or NiTEC in Electrical & Electronics Engineering or Microelectronics with at least 1 year of relevant experience
  • Preference with any prior experience in CMP (Chemical Mechanical Polishing) AMAT, DSP (Double side polishing), WET, Bonder, SWC (Single wafer cleaner) or SRB (Scrubber) tool maintenance
  • Comfortable with performing 12-hours shifts


We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Lim Zi Cheng  |   Registration No:  R2089949

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