Position Description

Senior / Staff Thin Film Flip Chip Engineer
Job Code 19715
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Focusing on developing and transferring of new thin film flip chip processes/technology. Primary focus on wafer level and die level LLO (Laser Lift Off) and its preceding / succeeding processes.
  • Actively drive process development, inclusive of process/product characterization, qualification and production pilot runs and volume ramp, through the matrix-management of a cross-functional team within the Singapore Operations, to achieve timely delivery of quality innovations and products to meet market and customer demands.
  • To introduce new products, processes and technologies within customer requirements, with the objective of ensuring process robustness and manufacturability, cost effectiveness and profitable yields, complete with post-release care.
  • Plan and perform experiments in collaboration with SJ design team, vendors, etc.
  • Establishing good process margins and inline controls including setting up SPC control chart as well as maintenance of Cp/Cpk performance.
  • Perform routine reporting of project status as well as creating & updating of process documentations, i.e FMEA, Operating Instructions, Process Characterization Report, Control Plan, etc.
  • Yield analysis and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.


  • Bachelor of Electrical & Electronics/Mechanical/Chemical/Materials Engineering/Chemistry/Physics or other relevant discipline.
  • Possesses Laser Lift Off experience, or other laser-based processes such as Lithography, Laser dicing/ singulation (stealth dicing, laser ablation, filamentation laser) etc.
  • Knowledge on SPC, DOE, FMEA, lean methodology, various analysis techniques, Minitab, JMP, basic LED functionality knowledge etc.
  • Minimum 3 years of experience in semiconductor environment, with direct experience in some of the following areas: technology transfer, process integration, yield engineering, unit/module process development, statistical process control
  • Self-driven leader and strong team player with keen technical ability, systematic approach, detail-oriented, excellent problem-solving skills, and positive attitude.
  • Ability to work independently, be hands-on and expected to dive into technical details as required.


We regret that only shortlisted candidates will be notified.


GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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