Principal focus of developing and transferring of new wafer finishing processes/technology which includes wafer bonding/ debonding, backgrinding, wafer dicing (stealth dicing, laser ablation, mechanical dicing, filamentation laser and other new dicing methods), wafer breaking, tape transfer, PnP, ULED mass transfer techniques etc of sapphire and silicon based wafers.
Actively drive process development, inclusive of process/product characterization, qualification and production pilot runs and volume ramp, through the matrix-management of a cross-functional team within the Singapore Operations, to achieve timely delivery of quality innovations and products to meet market and customer demands.
To introduce new products, processes and technologies within customer requirements, with the objective of ensuring process robustness and manufacturability, cost effectiveness and profitable yields, complete with post-release care.
Plan and perform experiments in collaboration with SJ design team, vendors, etc.
Establishing good process margins and inline controls including setting up SPC control chart as well as maintenance of Cp/Cpk performance
Perform routine reporting of project status as well as creating & updating of process documentations, i.e FMEA, Operating Instructions, Process Characterization Report, Control Plan, etc.
Yield analysis and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.
Job Requirements
Knowledge on SPC, DOE, FMEA, lean methodology, various analysis techniques, minitab , JMP , basic LED functionality knowledge etc
Bachelor's degree in Electrical, Mechanical, Chemical, Material engineering or relevant disciplines.
Experience in relevant semiconductor manufacturing processes of about 3-years.
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lim Zi Cheng | Registration No: R2089949
