Position Description

Senior/Staff Wafer Finishing Engineer
Job Code 19897
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Principal focus of developing and transferring of new wafer finishing processes/technology which includes wafer bonding/ debonding, backgrinding, wafer dicing (stealth dicing, laser ablation, mechanical dicing, filamentation laser and other new dicing methods), wafer breaking, tape transfer, PnP, ULED mass transfer techniques etc of sapphire and silicon based wafers. 
  • Actively drive process development, inclusive of process/product characterization, qualification and production pilot runs and volume ramp, through the matrix-management of a cross-functional team within the Singapore Operations, to achieve timely delivery of quality innovations and products to meet market and customer demands.
  • To introduce new products, processes and technologies within customer requirements, with the objective of ensuring process robustness and manufacturability, cost effectiveness and profitable yields, complete with post-release care.
  • Plan and perform experiments in collaboration with SJ design team, vendors, etc.
  • Establishing good process margins and inline controls including setting up SPC control chart as well as maintenance of Cp/Cpk performance
  • Perform routine reporting of project status as well as creating & updating of process documentations, i.e FMEA, Operating Instructions, Process Characterization Report, Control Plan, etc.
  • Yield analysis and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.



  • Degree qualified in Electrical & Electronics/ Mechanical / Chemical/ Material Engineering, Chemistry, Physics or other relevant discipline.
  • Minimum 3 years of experience in semiconductor environment, with direct experience in any/all of the following areas: technology transfer, process integration, yield engineering, unit/module process development, statistical process control
  • Knowledge on SPC, DOE, FMEA, lean methodology, various analysis techniques, Minitab, JMP, basic LED functionality knowledge etc.
  • Self-driven leader and strong team player with keen technical ability, systematic approach, detail-oriented, excellent problem-solving skills, and positive attitude.
  • Ability to work independently, be hands-on and expected to dive into technical details as required to cover thinly-resourced projects.


We regret that only shortlisted candidates will be notified.


GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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