Responsibilities

• Responsible for new equipment set-up and installation, sputter equipment maintenance, troubleshooting and improvement

• Responsible for equipment issue troubleshooting and executive preventive countermeasures

• Upkeep the technical specification for new & existing equipment

• Establish, review and revise the SOP for trouble shooting, prevention, proper equipment operation and maintenance

• Able to lead in yield improvement, cost reduction activities and cycle time reduction projects

• Initiate the improvement plan for sputter equipment, yield, product performance and cost reduction project

• Utilize SPC, FMEA, Cp, Cpk control method to ensure the line yield is met

• Prepare reports, flow diagram and charts as and when required

• Work closely with Process Engineers to monitor and improve the process capability

• Ensure the equipment at the optimum level and quality to minimise the requirement

• Lead and guide Assistant Engineers and Technical Specialist to complete task given by Management

• Perform any other ad-hoc duties as and when assigned by superior

 

Requirements

• Degree/Master in Material Science, Electronics or Mechanical Engineering

• Some working experience in sputter tools and maintenance in semiconductor industry is advantage

• Knowledge in thin film deposition process will be added advantage

• Possess good communication skills and able to work independently with minimal supervision

• Able to work in cleanroom environment and perform overtime as and when necessary

To find out more about this opportunity, please contact Lionel Liew at lionel.liew@gmprecruit.com.

 

We regret that only shortlisted candidates will be notified.

 

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793 |   EA Personnel: Lionel Liew   |   Registration No: R1330693