Position Description

Wafer Polishing Engineer (Process Developments/Improvements)
Job Code 20326
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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Responsibilities:

  • Perform Process development for silicon wafer manufacturing
  • Drive for continuous process improvement as well as optimising wafer polishing process
  • Manage the process in order to achieve quality, yield, and production goals.
  • Work closely with internal teams on process capability improvement and yield enhancement Develop and implement ideas for continuous improvement

 

Requirements:

  • Degree in Electrical / mechanical / Chemical / Material Engineering/Science or related disciplines
  • 3 years relevant work experience in Semiconductor industry
  • Proficient in statistical analysis skills such as SPC and JMP
  • Experience & knowledge of DOE an added advantage

 

 

We regret that only shortlisted candidates will be notified.

 

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R1104671

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