To develop or improve the processes to gain productivity, efficiency, quality and costs.
To qualify new materials, products, processes.
To co-ordinate NPI/NPQ activities with details and meeting timeline.
Proficiency in wire bonding, hands on experience is an requirement
To support analysis of failures from yield loss, reliability failures, new products, new materials.
To support company new initiatives such as new tape development, new material development.
Ability to maintain, repair and troubleshoot assembly and test machines
Ability to schedule and perform periodic maintenance on assembly and test machines
Job Requirements
Experience in Assembly and test processes of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
Knowledge in material science of the materials used in assembly of IC chips
Experience in ESEC, ASM, KNS wire bonders,
Experience in Gold and Silver wire bonding process will be an advantage
Knowledge in FMEA, SPC, OCAP, DOE
Good in problem solving, excellent interpersonal and communication skill
Knowledge in ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lim Zi Cheng | Registration No: R2089949
