Position Description

Lead Equipment Engineer (Packaging Mold / Semiconductor BEOL /North)
Job Code 21345
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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  • Equipment Engineer for moulding and MBB process.
  • Establish and lead Equipment control and improvement activities. Ability to research and analyze literature and reference materials for improvements developments.
  • Lead and work with a team of AE to attend and troubleshoot equipment related issue in the production line, defining containment plan and drive for resolution.
  • Drive cost-saving projects through innovative process or equipment simplification ideas.
  • Ability to work on the process characterization systematically and drive for improvement actions.
  • Maintaining equipment health through managing of SPC and periodic Pareto Analysis.
  • Ability to work in collaboration with cross-function team to resolve issues.
  • Owner of process operation instruction and ensure process compliance is met.


  • Bachelor’s Degree in Materials/Mechanical/Electrical Engineering or relevant engineering degree is required.
  • Min 5 years of working experience in process engineering.
  • Experience in compression/injection moulding and Micro Bead Blasting is preferred.
  • Experience with manufacturing operation, failure analysis and LED knowledge will be added advantage.
  • A team player with good communication, analytical and problem-solving skills.
  • Strong Organizational skill and is self-motivated.
  • Enjoys fast-paced and dynamic environment


We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd  |  EA Licence 11C3793  |  EA Personnel:  Novita Widjaja  |  Registration No: R22105960

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