Responsibilities:

• Development, process/product characterization and qualification of Wafer Finishing assigned process for pilot runs and volume ramp within the Singapore Operations.
• Establishing good process margins and inline controls of these new processes.
• Creating and updating of process specification and documentation of working procedure.
• Resolving reliability or yield issues related to the Wafer Break, UV Taping/Detaping, and Pick & Place processes as well as lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.
• Championing engineering experiments for process characterization.
• Responsible for cost-saving projects. 

Requirements:

• Bachelor's Degree in Electrical & Electronics Engineering /Mechanical Engineering or Materials  Engineering is required with more than 5 years of work experience in Wafer Backend processes such as Wafer Break (Singulation) and Die Sorting or Die Attach processes.
• Experience with ASM Die Sorter tools (MS90, MS899, MS100) would be advantageous
• Good interpersonal skills with good organizational skills and attention to detail.
• Strong knowledge of SPC and quality tools such as FMEA and Control Plan.
• Self-driven leader and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem-solving skills, and positive attitude.

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd  |  EA Licence 11C3793  |  EA Personnel:  Novita Widjaja  |  Registration No: R22105960