Job Description:
- To ensure products produced meet the product and customers' quality requirement
- To develop or improve the processes to gain productivity, efficiency, quality and costs.
- To qualify new materials, products, processes.
- To co-ordinate NPI/NPQ activities with details and meeting timeline.
- Conduct supplier sourcing and qualification activities jointly with purchasing, engineering and quality department
- Proficiency in wire bonding, hands on experience is an requirement
- To support and resolve daily technical issues in operations
- To support analysis of failures from yield loss, reliability failures, new products, new materials.
- To support company new initiatives such as new tape development, new material development.
- To benchmark new materials, new equipment technology in the market.
- To support quality, sales team in customers’ initiative such as process improvement, yield improvement.
- Develop and update Standard Operating Procedures when required
- Conduct training on new equipment and new process
- Support customers' audit and external agencies' audit
Requirements:
- Minimum Diploma, or Degree in Electronic or Material Science Engineering
- Minimum 3 years working experience in manufacturing environment, preferably in Semiconductor environment.
- Hands on experience in wire bonding is a must
- Hands on experience with Cu/Ag wire bonding is a plus
- Experience in Assembly and test processes of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
- Knowledge in material science of the materials used in assembly of IC chips
- Experience in maintenance of Assembly and test machines of Dicing, die attach, wire bond, encapsulation, testing, especially on wire bonding
- Experience in ESEC, ASM, KNS wire bonders,
- Experience in Gold and Silver wire bonding process will be an advantage
- Able to multi-tasks, and work in a fast-paced environment
- Good team player, able to work independently, resourceful, willing to learn new skills, with good initiatives
- Knowledge in FMEA, SPC, OCAP, DOE
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671
