Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to production stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis. Lead and drive SPC defects control. Review and update FMEA, Control plan OCAP, etc.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.

Requirements:

• Bachelor’s degree in Chemicals, Materials Science, microelectronics, mechanical engineering or relevant engineering degrees.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Minimum 3 years of hands-on process experience in areas of Wafer-level Fanout packaging production line or LCD/Panel Display production line.
• Well versed in 1 or more of the following packaging processes: Die Preparation, Reconstruction, RDL Technology
• Experience in SPC, DOE, FEMA, 8D, etc.

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671